Difference between revisions of "S3C2416"

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This chip is 14mm x 14mm size, FBGA package with ball pitch of 0.65mm. the S3C2416 chip is a 32/16-bit RISC cost-effective, low power, high performance micro-processor solution for general applications including the GPS Navigation and Mobile Phone markets. Additionally, in order to allow for lower system costs, higher performance and low power, the S3C2416 is fabricated using the 65nm low power CMOS process.
 
This chip is 14mm x 14mm size, FBGA package with ball pitch of 0.65mm. the S3C2416 chip is a 32/16-bit RISC cost-effective, low power, high performance micro-processor solution for general applications including the GPS Navigation and Mobile Phone markets. Additionally, in order to allow for lower system costs, higher performance and low power, the S3C2416 is fabricated using the 65nm low power CMOS process.
 
==Development Board/ODM Provider==
 
==Development Board/ODM Provider==
# [http://www.techor.com/product_281.html TECHOR's] [[SOM2416|System-on-Module]]
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# [http://www.techor.com/product_281.html TECHOR's] [[SOM2416|System-on-Module based on S3C2416]]([[SOM2416]])

Revision as of 13:32, 7 September 2009

It's a ARM926EJ RISC SOC(System-On-Chip) made by Samsung seminconductor.
This chip is 14mm x 14mm size, FBGA package with ball pitch of 0.65mm. the S3C2416 chip is a 32/16-bit RISC cost-effective, low power, high performance micro-processor solution for general applications including the GPS Navigation and Mobile Phone markets. Additionally, in order to allow for lower system costs, higher performance and low power, the S3C2416 is fabricated using the 65nm low power CMOS process.

Development Board/ODM Provider

  1. TECHOR's System-on-Module based on S3C2416(SOM2416)