Difference between revisions of "Computer-on-Module"

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* [http://www.compulab.co.il/products/computer-on-modules/cm-t54/ CM-T54 – TI OMAP5432 System-on-Module by CompuLab], dual-core Cortex-A15 based, TMS320DM64 DSP, 204-pin SO-DIMM, 73x68x5mm
 
* [http://www.compulab.co.il/products/computer-on-modules/cm-t54/ CM-T54 – TI OMAP5432 System-on-Module by CompuLab], dual-core Cortex-A15 based, TMS320DM64 DSP, 204-pin SO-DIMM, 73x68x5mm
 
* [http://www.compulab.co.il/products/computer-on-modules/cm-fx6/ CM-FX6 – Freescale i.MX6 System-on-Module by CompuLab], single/dual/quad core Cortex-A9 based, 75x65x6mm
 
* [http://www.compulab.co.il/products/computer-on-modules/cm-fx6/ CM-FX6 – Freescale i.MX6 System-on-Module by CompuLab], single/dual/quad core Cortex-A9 based, 75x65x6mm
* [http://www.e-consystems.com/tk1-som-tegra-k1-systemonmodule.asp eSOMTK1] - by [http://www.e-consystems.com/ e-con Systems, Inc. of USA],nVIDIA Tegra K1 4-Plus-1 ARM™ Cortex-A15 Quad core, 70 x 55mm
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* [https://www.e-consystems.com/tk1-som-tegra-k1-systemonmodule.asp eSOMTK1] - by [https://www.e-consystems.com/ e-con Systems, Inc. of USA],nVIDIA Tegra K1 4-Plus-1 ARM™ Cortex-A15 Quad core, 70 x 55mm
* [http://www.e-consystems.com/iMX6-system-on-module-som.asp eSOMiMX6] - by [http://www.e-consystems.com/ e-con Systems, Inc. of USA], Freescale i.MX6 single/dual/quad core Cortex-A9 based, 70 x 45 mm
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* [https://www.e-consystems.com/iMX6-system-on-module-som.asp eSOMiMX6] - by [https://www.e-consystems.com/ e-con Systems, Inc. of USA], Freescale i.MX6 single/dual/quad core Cortex-A9 based, 70 x 45 mm
* [http://www.e-consystems.com/DM3730-computer-on-module.asp eSOM3730] - by [http://www.e-consystems.com/ e-con Systems, Inc. of USA],ARM Cortex A8 DM3730/AM3703, 55 x 35 mm
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* [https://www.e-consystems.com/DM3730-computer-on-module.asp eSOM3730] - by [https://www.e-consystems.com/ e-con Systems, Inc. of USA],ARM Cortex A8 DM3730/AM3703, 55 x 35 mm
* [http://www.e-consystems.com/esom270.asp eSOM270] by [http://www.e-consystems.com/ e-con Systems, Inc. of USA],XScale®/ARM PXA270 application processor, 67.5 x 31 x 4 mm
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* [https://www.e-consystems.com/esom270.asp eSOM270] by [https://www.e-consystems.com/ e-con Systems, Inc. of USA],XScale®/ARM PXA270 application processor, 67.5 x 31 x 4 mm
 
* [[CIP]] - by [http://www.tianyeit.com tinayeit], That provide series of 40x40x3.5mm Size, Weight about 10g, the smallest and  lightest [[Computer-In-Package]] in the World!
 
* [[CIP]] - by [http://www.tianyeit.com tinayeit], That provide series of 40x40x3.5mm Size, Weight about 10g, the smallest and  lightest [[Computer-In-Package]] in the World!
 
* [[CIP30x]] - by Tinaye[http://www.tianyeit.com], TI 720MHz AM335x based cost effective Applicattiion Processor,LQA188, 40x40x3.5mm
 
* [[CIP30x]] - by Tinaye[http://www.tianyeit.com], TI 720MHz AM335x based cost effective Applicattiion Processor,LQA188, 40x40x3.5mm

Revision as of 22:47, 5 July 2016

A computer-on-module (COM) is a type of single-board computer(SBC), a subtype of an embedded computer system. It is also called System on ModuleSystem-on-Module as an extension of the concept of System on Chip (SoC) and lying between a full-up computer and a microcontroller in nature.

Today's COM/SOM modules are complete computers built on a single circuit board. The design is centered on a single microprocessor with RAM, input/output controllers and all other features needed to be a functional computer on the one board. However, unlike a single-board computer, the COM module will usually lack the standard connectors for any input/output peripherals to be attached directly to the board. Instead, the wiring for these peripherals are bussed out to connectors on the board.

The module will usually need to be mounted on a carrier board (or "baseboard") which breaks the bus out to standard peripheral connectors. Some COMs also include peripheral connectors and/or can be used without a carrier.

A COM/SOM solution offers a dense package computer system for use in small or specialized applications requiring low power consumption or small physical size as is needed in embedded systems.

Some devices also incorporate Field Programmable Gate Arrays.

The terms "Computer-on-Module" and "COM" were coined by Venture Development Corporation (Natick, MA, USA) to describe this class of embedded computer boards. The term became more notable upon industry standardization of the COM Express format.

A number of manufacturers offer products which are defined as system-on-module or computer-on-module. Among those are e-con Systems in St. Louis, Mo; Advanced Knowledge Associates (www.a-k-a.net) in Santa Clara, CA; BCM Advanced Research (www.bcmcom.com) in Irvine, CA; Embedded Systems (www.embedded-systems.net); MEN Micro (www.menmicro.com) in Ambler, PA; CompuLab in Israel; DAVE Embedded Systems (www.dave.eu) in Italy; Kaynes Technology in New York and India; PHYTEC America in Seattle, WA; Variscite in Israel; Toradex in Switzerland and Seattle, WA; MYIR (www.myirtech.com) in Shenzhen, China; Technologic Systems near Phoenix, AZ.

Computer-on-Module Provider